New product from Ashland reduces styrene emissions
Lower styrene emissions (12 ppm) in the workplace
Ashland makes easier processing possible with Derakane™ Signia™ resins, in addition to enhanced environmental performance, improved workplace conditions and increased worker satisfaction.
Introduced in 1965 to combat corrosion in chlorine plants, Derakane™ epoxy vinyl ester resins have become the industry standard for corrosion-resistant fiber reinforced polymer (FRP) equipment. With the introduction of Derakane™ Signia™, Ashland has leveraged new technology to improve workability as well as environmental performance and workplace conditions.
Derakane™ Signia™ 411 bisphenol-A epoxy vinyl ester resin has been evaluated in both laboratory studies and practical trials to demonstrate how this valuable new technology provides a cleaner, more efficient shop environment while meeting regional styrene emission requirements.
Reducing styrene emissions
The reduction of styrene emission has gained importance to the composites industry over the past several years with the introduction of many regulations regarding human exposure to styrene. Derakane™ Signia™ resins feature a unique vapor suppression technology that greatly reduces styrene emissions upon curing by promoting the formation of a vapor suppressant film (Figure 1. As the technology requires air to pass over the laminate surface to promote the formation of the vapor suppressant film, the FRP fabrication method used will affect efficacy. The suppression film begins to form:
- in hand lay-up as soon as consolidation and rollout have stopped (shift from dynamic to static emissions, Figure 2)
- in spray-up applications (using fan jet nozzles), once resin spray-up stops
- in filament winding, through the good air flow over the laminate surface promoted by the rotating mandrel
Styrene emission occurs when the resin surface is disturbed in processing, but the suppression film quickly reforms and allows for the measurable improvement of environmental and workplace conditions.